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Directory:NOVA Thermal Electric Chips

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A promising thermal-electric technology is being developed by the Nova Institute of Technology, a company out of Salt Lake City. The company is in late R&D stage in bringing forward an efficient, low-heat conversion to electricity method.

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Official Website

  • http://NovaInstituteofTechnology.com - (The site does not yet have information posted about this technology. This PESWiki coverage is the only Internet coverage thus far, as of Feb. 27, 2007.)

Overview

On Feb. 19, 2007, David Yurth

Brown’s invention is still as valid today as it was thirty years ago, and it still suffers from the same fundamental weakness. There are numerous ways to generate enormous quantities of electrons – the use of nano-structures such as LED’s is a good one – but they all suffer from the same weakness. The internal resistance associated with transporting, collecting and harnessing electron flows is normally so high with such devices that even though the electrons are liberated in one part of the circuit, they are reabsorbed in another.

We think we may have a solution to this problem. The positively charged electrically conductive thin film materials we are using operate at less than 2 ohms per square, with virtually zero capacitance. They can be deposited using a variety of methods on a wide variety of materials, both conductive and inert. Because the films can be deposited at about 12-15 atoms thickness [50 nanometers], it is possible to produce very low resistance non-capacitive conductance layers in significant numbers, thus increasing surface areas while at the same time virtually eliminating the resistance barriers.

In addition, because we have learned how to produce such layers in a form that is positively charged, with stability and longevity [which has not been possible before], the conductive film serves the purpose of actually attracting or ‘capturing’ the liberated electrons and shuttling them to an inductive layer outside the actual crystalline lattice itself. By using this combination of materials and thin film technologies, we have been able to produce several generations of heat conversion and energy production integrations which we are now testing in our lab.

I think it would be useful to revisit Brown’s patented technique by substituting conventional substrate and conductive materials with our own, more efficient designs. Perhaps one day we will be able to dedicate some time and resources to this effort.

Contact

David Yurth
email: <davidyurth {at} comcast.net>

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